Vapor Chamber Cooling (VC Cooling) - definition

A vapor chamber cooling is a process to cool down the system temperature which is a bit similar to the working principle of a heat pipe but more efficient and effective. In a heat pipe system, a liquid material is used in pipe structures; one end is connected to the heat generation surface and the other one is curved to a little far from that heat generation site. When sufficient heat is generated then the liquid is converted into vapor and moved through the spiral pipes to the other end and cool down due to travel and heat dissipation for capillarity.
In the vapor chamber cooling system, the process is almost the same except for the pipe architectures. Because when we talk about embedding a liquid cooling system to a tiny place then heat pipes is not the wise decision to choose. In these cases, we use a vapor chamber, which uses a flat surface instead of pipes and liquid takes place inside of the copper chamber. In this method, the liquid gets cool down in less time than the pipes because of the extended surface. In today’s smartphone vapor chambers are used in mobile phones to cool down the CPU temperature.
To avoid a few disadvantages of this system, a new type of cooling system has been introduced by one of the most popular mobile manufacturers Xiaomi, which is called Loop LiquidCool technology.